[BrianG]

Yeah, but I can see why they do it that way - to allow the boards to be removable for repair. If they made the case a little bit wider, they could use a clamping mechanism instead to allow the use of regular thermal compound (not adhesive). The tough part is making it so the board doesn't move around with bumps and vibrations. Thermal compound loses its efficiency if it gets moved around a lot once applied...